光智汇联
Thermal design
Review the service and its applications. Scope, deliverables and fees are agreed following discussion.
Discuss the service →Thermal design
Examine hot spots, heat transfer and surrounding airflow in the context of the actual mechanical design.
Relate temperature results to specific components
Start with the whole-product temperature distribution, then use sections to locate temperatures around the LEDs, substrate, housing and power supply.
Understand the airflow around the product
A recorded airflow simulation around a high-bay luminaire, focused on the flow field near the housing. Arrows and temperature scales are retained from the original analysis.
Observe temperature changes as well
Temperature curves and structural temperature maps offer different views. Analysis must account for dissipated power, ambient conditions, mounting orientation and material contact.
These simulations are from an earlier project. Temperature targets and pass/fail decisions for a new project require verification under its specified conditions and on samples.
Inputs and boundary conditions
Power dissipation, ambient conditions, mounting and material contact.
Mechanical concept and analysis results
Temperature, key sections and airflow data linked to areas requiring mechanical adjustment.
Sample temperature-rise verification
Measurement points and conditions, comparison with simulation and issues requiring closure.
Bring your project requirements
Provide power and thermal dissipation figures, the mechanical model, materials, mounting method and operating environment. Scope is agreed by thermal system, conditions and iteration rounds.
Discuss thermal designThe brief and formal quotation confirm the scope, deliverable depth and number of revision rounds.
